CFP: Transactions on MTT Special Issue on mm-Wave Circuits and Systems
Submission Date: July 1, 2011, Publication Date: January 2012
Millimeter-wave wireless technologies are very promising for multi-gigabit communication systems, high resolution/accuracy imaging, sensing and detection. In recent years, the scientific and engineering communities have seen wireless systems operating in the 60 GHz band that can support Gbps rates for short range and indoor applications, such as high definition television, 3D television and 4K digital camera. For outdoor applications, commercial, fixed wireless access using 71-76 GHz, 81-86 GHz and 120 GHz (NTT at Beijing Olympics: 10Gb/s over 1 km) can also provide > 1 Gbps data transmission for links exceeding 1 km. The IEEE Transactions on Microwave Theory and Techniques invites manuscript submissions for a Special issue, with the aim to provide an appropriate venue, review perspectives, and foster innovations in the area of mm-wave circuits and systems above 40 GHz that is of interest for the MTT engineering community. Topics to be covered include, but are not limited to:
Devices and Systems:
- Planar circuits (CMOS, SiGe, III-V, MEMS), components and systems for high speed wireless systems, and 77 GHz and 79-81 GHz anti-collision radars.
Technology, Instrumentation, Imaging and Reliability:
- Imaging, radar and sensing techniques and systems above 60 GHz
- Platform requirements and effects for mm-wave systems and applications above 40 GHz
Theoretical Issues and Modelling:
- Modelling of channel effects
- Communication link studies ( LOS vs. NLOS)
Please see the transaction web site at http://www.mtt.org/publications/Transactions/transactions.htm for instructions on author guidelines. All submissions must be received by July 1, 2011 with a planned publication date of January 2012.
CSICS 2011: First Call for Papers
From its beginning in 1978 as the GaAs IC symposium, CSICS has evolved to become the preeminent international forum for developments in compound semiconductor integrated circuits, embracing GaAs, InP, GaN, SiGe, and more recently, CMOS technology. Coverage includes all aspects of the technology, from materials issues and device fabrication, through IC design and testing, high volume manufacturing, and system applications. The IEEE Compound Semiconductor IC Symposium (CSICS) provides the ideal forum to present your latest results in high-speed digital, analog, microwave/millimeter wave, mixed mode, and optoelectronic integrated circuits. First-time papers concerned with the utilization and application of InP, GaAs, SiGe, GaN and other compound semiconductors in military and commercial products are invited.
Authors must submit an abstract electronically using the www.csics.org web page. Please note that the only accepted file format is PDF.
Submission deadline: COB on May 18, 2011.
Further questions on abstract submission may be addressed to the Symposium Technical Program Chair:
University of Toronto