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MTT-S Launches New Web Site

On June 15th this year, the IEEE MTT-Society launched an all new web site (http://www.mtt.org) . If you are familiar with the old MTT web site, you will immediately notice that the new site has a very different look. Spend some time surfing the site and you will also notice a reorganization of information as well as some significant new content. From the home page you can launch an ieee.tv video from this year's IMS held in Anaheim, CA. Free downloads of several sample articles from all three MTT-S publications are available under the PUBLICATIONS tab. A NEWS tab provides access to current News, Announcements and Upcoming Events. You can also read about MTT-Society history under the ABOUT tab.

MTT-S Web Site Survey
Most importantly, please take a short (~3 minute) survey to tell us a little bit about you and what kind of content we can add to the web site to serve you better. Both members and non-members of IEEE are invited to take the survey and to visit the web site, so please share the link information with your colleagues. The survey can be accessed from the new MTT-S home page or directly at http://www.mtt.org/survey-invitations.html .

Mike Golio


CFP: 19th IEEE International Conference on Electrical Performance of Electronic Packaging and Systems

EPEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis, synthesis and design of electronic interconnections, packages and systems. It also focuses on new methodologies and CAD/design techniques for evaluating and ensuring signal, power and thermal integrity in high-speed designs. EPEPS is jointly sponsored by the IEEE Components, Packaging and Manufacturing Technology Society and IEEE Microwave Theory and Techniques Society.

Deadline: July 16, 2010, 8pm, PST

For more information, visit the conference web site at www.epeps.org

Dr. Kathleen Melde

Successful IMS2010

Positive reviews continue to roll in on a very successful IMS2010 which was held in Anaheim, CA during May 23-28, 2010.  The IEEE.tv coverage of the entire Microwave Week which included Conference highlights, the Plenary Session, special session for honoring Dr. Kiyo Tomiyasu,  luncheon for Chuck Swift and selected MicroApps presentations are now available for viewing.  The IMS2010 Event Showcase can be viewed at http://www.ieee.tv/event-showcase/IMS_2010_International_Microwave_Symposium

In addition, event photographs taken during IMS2010 taken by Lyle Photography (Jim and Tammy Lyle), Tim Lee and Ed Niehenke have now been posted and can be viewed and downloaded at http://mttsadcom.zenfolio.com/f934945622

Tim Lee

2011 IEEE Radio Wireless Week

Summary Submission Deadline: 30 July, 2010

The 2011 IEEE Radio Wireless Week (RWW2011) will be held the week of Sunday, January 16, 2011 in Phoenix, Arizona, USA at the Renaissance Glendale Hotel. This exciting week includes the IEEE Radio and Wireless Symposium (RWS) and the IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF). For 2011, we are premiering three topical conferences on power amplifiers (PAWR), wireless sensor networks (WiSNet), and biomedical radio and wireless technologies (BioWireleSS). Workshops, short courses, panels, and a relevant industry exhibition will be held. RWW is sponsored by IEEE Microwave Theory and Techniques Society and co-sponsored by IEEE Communications Society, Antennas and Propagation Society, and Vehicular Technology Society.

RWS2011 will cover all areas of radio and wireless systems, including but not limited to antennas, propagation modeling, transceiver technologies, MIMO, signal processing, SDR & cognitive radios, wireless networks, emerging technologies, DSP, components and packaging.

Visit us at: http://www.radiowireless.org/rws2011/

SiRF2011 covers Si-based devices, passives, integrated circuits, and applications for high-frequency systems through three days of sessions. Student paper competition will also be held as in the past years. The call for papers is available at: http://www.silicon-rf.org/

PAWR2011 covers innovative work in RF/microwave power amplifiers technologies, including but not limited to, high power/wideband active devices, mobile/avionic/space applications, modeling, characterization, design/topologies, green PA, integration, packaging, linearization/efficiency enhancement. The call for paper is available at: http://www.radiowirelessweek.org/PAWR2011/

BioWireleSS2011 is the first ever IEEE conference focused on the wireless revolution targeting the medical field. A huge potential exists for the innovation and incorporation of wireless in various facets of the medical profession. The conference is focused on providing a healthy mix of actual clinical work incorporating wireless technologies with more fundamental science and engineering research in this area.  BioWireless2011 is technical co-sponsored by IEEE Engineering in Medicine and Biology Society. The call for paper is available at: http://www.radiowirelessweek.org/biowireless/

WiSNet2011 covers areas, including but not limited to, sensors for communications, radar, positioning, and imaging, frontends, positioning devices and technologies, sensor networks and smart sensors, RFID, and SAW technologies. The call for paper is available at: http://www.radiowirelessweek.org/WiSNet2011/

We invite you to participate by contributing to the technical program (submission deadline July 30) and encourage you to plan for attending RWW 2011. See you in Phoenix!

RWS2011 Steering Committee

Emerson & Cuming Microwave Products, Inc.
Emerson & Cuming Microwave Products is the world leader of Engineered Materials for RF/Microwave Interference, offering quality products to Design Engineers since 1948. www.eccosorb.com

Calls for Papers for Upcoming Conferences

(July, August and September deadlines)

Upcoming Conferences

(July, August and September)

You are receiving the IEEE microwave magazine e-Newsletter as a free monthly service provided by the IEEE MTT-Society. MTT-Society sponsored conferences, workshops, contests, etc. can be publicized in the IEEE microwave magazine e-Newsletter.

Contributions, questions, and comments should be sent to: microwave.e-news.editor@ieee.org.