MTT-11 Contest on "Creativity and Originality in Microwave Measurements"
This contest highlights creative and original microwave measurement setups or procedures. There is no need to use the latest or most expensive equipment, only to have a good idea that presents a creative solution to an existing measurement problem. Ideas may include software, hardware, calibrations, and/or theory that focus on making the job of the bench-level engineer easier or more satisfying.
This contest is open to all individuals or groups, students as well as non-students with prize amounts totaling $1000. The contest idea should not have been previously published or submitted for publication. To enter this contest email a 2 page PDF-file describing the microwave measurement setup or procedure to Jan Verspecht (contact@janverspecht.com) by May 15, 2009.
For more information visit the MTT-11 website: http://www.mtt.org/~mtt11.
Fall Undergraduate/Pre-Graduate Scholarship
The purpose of the scholarship program is to attract undergraduates to the microwave and RF discipline, and to encourage them to pursue graduate degrees in the field.
Highlights
- The IEEE Microwave Theory and Techniques Society (MTT-S) will award up to ten $1500 undergraduate/pre-graduate scholarships for Spring 2009.
- The student must identify a faculty mentor who will supervise the applicant's project or thesis work in the microwave/RF area. Alternatively, project work may be conducted in conjunction with industry, but a faculty mentor must still be identified.
- Applicant must be an IEEE student member, and the faculty mentor must be an IEEE MTT-S member.
Application Deadline: May 15, 2009
For the application information please visit: http://www.mtt.org/ and select "Students".
Questions may be directed to:
Rhonda Franklin, Ph.D.
Associate Professor
ECE Department
University of Minnesota
4-174 EE/CSci Building
200 Union Street SE
Minneapolis, MN 55455
P:612-626-8978
F:612-625-4583
E-mail:drayton@umn.edu
CFP: 18th Conference on Electrical Performance of Electronic Packaging and Systems
The general subject of the conference is the electrical design, analysis, modeling and measurement of interconnections and packaging structures of electronic systems. The goal of the conference is to be the leading forum for exchange of ideas on advanced and emerging topics on the electrical design of systems to assure electrical performance; especially signal integrity and power integrity.
Authors are invited to submit papers describing new technical contributions in the areas broadly covered below:
- Current and future issues related to signal interconnections including on-chip and system interconnect structures.
- Signal integrity of interconnections.
- Power integrity of electronic components and systems.
- Design and measurement of high speed links, including jitter and noise management and characterization.
- Innovative interconnect packaging structures and their electrical performance.
- Measurement and data analysis techniques for system level and on-chip structures.
- Signal and power integrity in mixed signal and RF circuits and modules.
- RF/microwave packaging structures and their electrical performance.
- Electromagnetic modeling and simulation algorithms, tools and design flows.
- Macromodeling and model reduction as it applies to electrical analysis.
- Advances in transmission-line analysis techniques.
Paper Submission: Electronic submissions of no more than four pages must be received no later than July 18, 2009. Papers should be compliant with the general standards of the IEEE, including inclusion of appropriate references.
Student Paper Award: Two student best paper awards may be presented. The paper submission must include a letter from the student’s advisor to be eligible. Short Courses/Workshops: On Sunday, October 18, a workshop entitled "Future Directions in Packaging" will be presented and short courses/tutorials may be offered.
For more information please see the web site at: http://www.epep.org or contact: Andreas Weisshaar, email: andreas@eecs.oregonstate.edu Kelly Sutton, email: pasutton@email.arizona.edu
1st Annual Rudy Henning Distinguished Mentoring Award To Be Given At WAMICON
The organizers of the upcoming 2009 10th annual WAMICON (IEEE Wireless and MIcrowave technology conference, April 20-21, Sand Key Beach, Clearwater, Florida) have announced that a new annual award will be given out at the conference. The Rudy Henning Distinguished Mentoring Award has been created to recognize an individual who has performed exemplary service encouraging students and/or mentoring young engineers to advance careers in the areas of RF/Microwave and/or Wireless Engineering.
To be considered for this award, canidates must be a current or past member of IEEE who has had a strong impact on influencing students, young engineers or young faculty members to further their professional careers in the areas of RF/Microwave and/or Wireless Engineering.
Factors to be considered are leadership, innovation, dedication, distinguished service and breadth of participation. In keeping with Rudy Henning's career which has been dedicated to attracting students, both at the secondary school and college level, to pursue a career in RF/Microwave engineering, the goal of this award is to recognize individuals who have been influential in this endeaver.
This year's recipient of the award is Dr. Tom Brazil. Dr. Brazil is a noted educator at University College Dublin (UCD). He is a Fellow of the IEEE. He is also Fellow of Engineers Ireland and a Member of highly respected Royal Irish Academy in which he chairs the Science Committee. He has been a tireless, highly inspirational mentor to countless undergraduate and graduate students in his career spanning well over 30 years.